Shear strength of Cu-to-Cu joints using mixed Ag particle paste
نویسندگان
چکیده
منابع مشابه
IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
The growth kinetics of intermetallic compound (IMC) layers formed between Sn-3Ag-6Bi-2In ball-grid-array (BGA) solder and Au/Ni/ Cu substrate by solid-state isothermal aging were examined at temperatures between 343 and 443K for 0 to 100 days. A quantitative analysis of the IMC layer thickness as a function of time and temperature was performed. The intermetallic layer exhibited a parabolic gro...
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ژورنال
عنوان ژورنال: QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
سال: 2015
ISSN: 0288-4771
DOI: 10.2207/qjjws.33.75s